Layers: 2
Material: FR-4+Copper Base
Surface Finish: ENIG
Board Thickness: 3.8mm
Minimum Hole: 0.4mm
Line Width & Space: 6 / 6mil
Special Technology: Thermoelectric Separation
层数：2
板材：FR4+紫铜
表面处理：沉金
板厚：3.8MM
最小孔：0.4MM
线宽线距：6/6mil
工艺：多层热电分离
sal@jetfgo.com
0755-23300780 / 23302390
0755-23302910
Building 18, District 1, Xinhe Xinxing Industrial Park, Fuhai Street, Baoan District, Shenzhen
